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Hyundai Motor Company, Kia Corporation and Infineon sign multi-year supply agreement for power semiconductors

MUNICH, GERMANY  18 October 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Hyundai Motor Company and Kia Corporation have signed...

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Molex Announces KickStart Connector System, First OCP-Compliant, All-in-One Boot-Drive Connectivity Solution with Integrated Power and Signal Circuits

Single, standardized cable assembly provides common hardware solution that combines power, plus low- and high-speed signals, to simplify server designs Flexible, easy-to-implement interconnectivity...

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HKSTP’s Biggest Ever Elevator Pitch Competition 2024 Hits Four World Cities to Bring Global Innovators to Hong Kong and Springboard to Mainland China and Asia Success

Startups battle for up to US$5 million in venture funding, US$240,000 in cash prizes, plus unrivalled partnership and funding opportunities HONG KONG SAR ...

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Infineon doubles Co-Innovation Space to accommodate more startups

Welcomes Korea SMEs and Startups Agency as new ecosystem partner in Infineon global startup co-innovation program SINGAPORE 16 October 2023 – At OktoberTech™ Asia...

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HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in Hong Kong J2 Semiconductor Plans to Establish R&D Center and First SiC Wafer Fab in Hong Kong

R&D Centre at Hong Kong Science Park under the plan will conduct independent R&D and production of third-generation semiconductor chips HONG KONG SAR...

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SHARP Corporation Marks 111 Years of Innovation, Unveiling Future-Forward Solutions at Its Anniversary & Product Launch Event in Singapore

SINGAPORE  13 October 2023 – SHARP Corporation, a pioneering leader in innovative consumer electronics and appliances, is proud to announce the celebration of...

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Samsung’s Portable SSD T9 Empowers Professionals with Exceptional Performance and Data Reliability

The T9 is Samsung’s first Portable SSD featuring a USB 3.2 Gen 2×2 interface, delivering increased productivity with up to 2,000 MB/s read/write...

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DFI Facilitates DHBW Engineering to Achieve Third Place at Formula Student Germany with a Focus on Autonomous Driving

TAIPEI, TAIWAN 12 October 2023 – DFI, the global leader in embedded motherboards and industrial computers, recently sponsored the DHBW Engineering Team with their...

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Hantec Group’s IT-Driven Transformation to Offer the Best Trading Platform for Clients

HONG KONG SAR 11 October 2023 – Hantec Group, a prominent figure in the financial industry, is charting a bold course towards becoming...

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