Newly developed lens and a variety of options to meet the growing demand for power devices
FPA-3030i6
MELVILLE, N.Y., Oct. 04, 2024 – Canon Inc., the parent company of Canon U.S.A., Inc., a leader in digital imaging solutions, announced the release of the FPA-3030i6 i-line1 stepper, a new semiconductor lithography system for processing wafers with a diameter of 8 inches (200 mm) or smaller.
The FPA-3030i6 system employs a newly developed projection lens that works to help reduce lens aberration for high exposure dose processes2 and improve productivity by shortening exposure time.
The full release from Canon Inc. can be found here.
Optional products including a wafer handling system for special substrates are available for order to meet users’ manufacturing needs for various emerging semiconductor devices including high-power and high-efficiency devices.
The FPA-3030i6 semiconductor lithography system is designed to support a wide range of device fabrication thanks to a variety of available process options for silicon, as well as sapphire and compound semiconductor materials.
Canon will offer wafer feeding options enabling handling of substrates from 2 inches (50 mm) to 8 inches (200 mm) in diameter, as well as thick, thin and warped substrate handling.
